Washington State University

Indranath Dutta - Professor

The School of Mechanical and Materials Engineering

Indranath Dutta - Professor

Interdisciplinary Excellence Built On World-Class Knowledge

portrait
Indranath Dutta

Contact Information:

office Dana 149b
telephone 509 335 8354
e-mail idutta@wsu.edu
Postal mail Indranath Dutta
School of Mechanical and Materials Engineering
Washington State University
PO BOX 642920
Pullman, WA 99164-2920

Joined MME in 2008;
Ph.D. in Materials Science and Engineering from the University of Texas at Austin, in 1988.


Research Interests:

  • Multi-physics phenomena in Materials Science - thermal/mechanical/electrical/electromagnetic interactions
  • Near-interface effects in multi-component materials, with emphasis on materials for microelectronics
  • Materials reliability in micro-systems and composites
  • Electrically-activated manufacturing at nano to meso scales - nanolithography, electromagnetic jigsaw

Recent Publications:

  • P. Kumar and I. Dutta, “Influence of Electric Current on Diffusionally Accommodated Sliding at Hetero-Interfaces”, Acta Materialia, 59, pp. 2096-2108, 2011.
  • I. Dutta, P. Kumar, and M.S. Bakir , “ Interface-related Reliability Challenges in 3-D Interconnect Systems with Through-Silicon Vias “, JOM, October 2011, pp. 70-77.
  • J. Liu, P. Kumar, I. Dutta, R. Raj, R. Sidhu, M. Renavikar and R. Mahajan, “Liquid phase sintered Cu–In composite solders for thermal interface material and interconnect applications”, J. Mater. Sci., 46, 7012-7025, 2011.
  • M. Burkhard, S. Kuwano, T. Fujita, I. Dutta and M.W. Chen, “Correlation between Whisker Growth, Dissolution Pitting and Si Precipitation in an Al Thin Film on Si During Heat Treatment”, J. Mater. Sci., 45, 2010, pp. 3367-3374
  • I. Dutta and P. Kumar, “Electric Current Induced Liquid Metal Flow: Application to Coating of Micro-patterned Structures”, Appl. Phys. Lett., 94, 184104, 2009.
  • B. Ye, B.S. Majumdar and I. Dutta, “Texture Development and Strain Hysteresis in a NiTi Shape Memory Alloy During Thermal Cycling Under Load, Acta Materialia, 57, pp. 2403–2417, 2009.
  • Z. Huang, P. Kumar, I. Dutta, J. H. L. Pang, R. Sidhu, M. Renavikar and R. Mahajan, “Fracture of Sn-Ag-Cu/Cu joints: I: Effect of loading conditions and processing parameters”, J. Elec. Mater. (Accepted, Sept 2011)
  • P. Kumar, Z. Huang, I. Dutta, R. Sidhu, M. Renavikar and R. Mahajan, “Fracture of Sn-Ag-Cu joints on Cu substrates: II. Development of Fracture Mechanism Map”, J. Elec. Mater. (Accepted, Oct 2011).

Publications listed at Google Scholar:

First 100 Titles in date order
List format:
 Title (Link to document)
 Authors
 Source Publication
Cited by Year
Materials and Processing of TSV
P Kumar, I Dutta, Z Huang, P Conway
3D Microelectronic Packaging, 47-69 , 2017
  2017
Microstructural and Reliability Issues of TSV
P Kumar, I Dutta, Z Huang, P Conway
3D Microelectronic Packaging, 71-99 , 2017
  2017
Role of Diffusional Interfacial Sliding during Temperature Cycling and Electromigration-Induced Motion of Copper Through Silicon Via
L Meinshausen, M Liu, I Dutta, TK Lee, L Li
Semiconductor Devices in Harsh Conditions, 197-224 , 2016
  2016
Eliminating Whisker Growth by Indium Addition in Electroplated Sn on Copper Substrate
SD Mahapatra, BS Majumdar, I Dutta, S Bhassyvasantha
Journal of Electronic Materials, 1-14 , 2016
  2016
On the deformation mechanisms and electrical behavior of highly stretchable metallic interconnects on elastomer substrates
Y Arafat, I Dutta, R Panat
Journal of Applied Physics 120 (11), 115103 , 2016
  2016
Effect of Composition and Thermal–Mechanical History on the Creep Behavior of Sn–Ag–Cu Solders—Part I: Experiments
B Talebanpour, U Sahaym, I Dutta
IEEE Transactions on Device and Materials Reliability 16 (3), 318-325 , 2016
1 2016
Effect of Composition and Thermal–Mechanical History on the Creep Behavior of Sn–Ag–Cu Solders—Part II: Model
B Talebanpour, U Sahaym, I Dutta
IEEE Transactions on Device and Materials Reliability 16 (3), 326-335 , 2016
1 2016
A molecular dynamics evaluation of the effect of dopant addition on grain boundary diffusion in tin: Implication for whisker growth
S Banerjee, I Dutta, BS Majumdar
Materials Science and Engineering: A 666, 191-198 , 2016
3 2016
Thermo-mechanically and electrically induced interfacial incompatibility in 3D packages with through silicon vias
H Yang, L Meinshausen, TK Lee, I Dutta
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 ... , 2016
  2016
Influence of Indium Addition on Whisker Mitigation in Electroplated Tin Coatings on Copper Substrates
L Meinshausen, S Bhassyvasantha, BS Majumdar, I Dutta
Journal of Electronic Materials 45 (1), 791-801 , 2016
3 2016
Effect of joint scale and processing on the fracture of Sn-3Ag-0.5 Cu solder joints: application to micro-bumps in 3D packages
B Talebanpour, Z Huang, Z Chen, I Dutta
Journal of Electronic Materials 45 (1), 57-68 , 2016
1 2016
Super-stretchable metallic interconnects on polymer with a linear strain of up to 100%
Y Arafat, I Dutta, R Panat
Applied Physics Letters 107 (8), 081906 , 2015
5 2015
Reliability Implications of Thermo-Mechanically and Electrically Induced Interfacial Sliding of Through-Silicon Vias in 3D Packages
L Meinshausen, M Liu, TK Lee, I Dutta, L Li
ASME 2015 International Technical Conference and Exhibition on Packaging and ... , 2015
1 2015
Highly Stretchable Interconnects for Flexible Electronics Applications
Y Arafat, R Panat, I Dutta
ASME 2015 International Technical Conference and Exhibition on Packaging and ... , 2015
  2015
Fracture Mechanisms in Sn-Ag-Cu Solder Micro-Bumps for 3D Microelectronic Packages
B Talebanpour, I Dutta
ASME 2015 International Technical Conference and Exhibition on Packaging and ... , 2015
1 2015
Mitigation of tin whisker growth by dopant addition
L Meinshausen, S Banerjee, I Dutta, B Majumdar
ASME 2015 International Technical Conference and Exhibition on Packaging and ... , 2015
2 2015
Interfacially engineered micro and nano-scale Cu-In composites as high performance thermal interface materials for advanced electronics
I Dutta, J Liu, K Mireles, P Kumar, L Meinshausen
Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 635-640 , 2014
1 2014
Effects of Microstructure and Loading on Fracture of Sn-3.8 Ag-0.7 Cu Joints on Cu Substrates with ENIG Surface Finish
Z Huang, P Kumar, I Dutta, R Sidhu, M Renavikar, R Mahajan
Journal of electronic materials 43 (12), 4485-4496 , 2014
5 2014
A general methodology for calculating mixed mode stress intensity factors and fracture toughness of solder joints with interfacial cracks
Z Huang, P Kumar, I Dutta, JHL Pang, R Sidhu
Engineering Fracture Mechanics 131, 9-25 , 2014
6 2014
Interfacially engineered liquid-phase-sintered Cu–In composite solders for thermal interface material applications
J Liu, U Sahaym, I Dutta, R Raj, M Renavikar, RS Sidhu, R Mahajan
Journal of Materials Science 49 (22), 7844-7854 , 2014
4 2014
Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
I Dutta, J Liu, K Mireles, P Kumar, L Meinshausen
Institute of Electrical and Electronics Engineers Inc. , 2014
  2014
Electric current induced flow of liquid metals: Mechanism and substrate-surface effects
P Kumar, J Howarth, I Dutta
Journal of Applied Physics 115 (4), 044915 , 2014
8 2014
Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints
Z Huang, P Kumar, I Dutta, R Sidhu, M Renavikar, R Mahajan
Journal of Electronic Materials 43 (1), 88 , 2014
6 2014
Effect of processing on the microstructure and fracture of solder microbumps in 3D packages
Z Chen, B Talebanpour, Z Huang, P Kumar, I Dutta
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th, 534-537 , 2013
2 2013
Recrystallization and ${\ rm Ag} _ {3}{\ rm Sn} $ Particle Redistribution During Thermomechanical Treatment of Bulk Sn–Ag–Cu Solder Alloys
U Sahaym, B Talebanpour, S Seekins, I Dutta, P Kumar, P Borgesen
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 ... , 2013
6 2013
Inverse skeletal strokes
D Liu, R Klette
Pacific-Rim Symposium on Image and Video Technology, 1-11 , 2013
1 2013
Fracture Behaviors of Simulated Sn-Ag-Cu Solder Microbumps: Effects of Joint Scale and Aging
Z Huang, I Dutta, GS Subbarayan
ASME 2013 International Technical Conference and Exhibition on Packaging and ... , 2013
1 2013
Effect of aging on impression creep behavior of Pb-free solders
B Talebanpour, U Sahaym, I Dutta, P Kumar
ASME 2013 International Technical Conference and Exhibition on Packaging and ... , 2013
2 2013
Effect of substrate surface on electromigration-induced sliding at hetero-interfaces
P Kumar, I Dutta
Journal of Physics D: Applied Physics 46 (15), 155303 , 2013
2 2013
Electromagnetic jigsaw: Metal-cutting by combining electromagnetic and mechanical forces
P Kumar, A Mishra, T Watt, I Dutta, DL Bourell, U Sahaym
Procedia CIRP 6, 600-604 , 2013
5 2013
Constitutive models for intermediate-and high-strain rate flow behavior of Sn3. 8Ag0. 7Cu and Sn1. 0Ag0. 5Cu solder alloys
D Chan, X Nie, D Bhate, G Subbarayan, WW Chen, I Dutta
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (1 ... , 2013
5 2013
Levers for thermoelectric properties in titania-based ceramics
M Backhaus-Ricoult, JR Rustad, D Vargheese, I Dutta, K Work
Journal of electronic materials 41 (6), 1636-1647 , 2012
19 2012
Microstructural evolution and some unusual effects during thermo-mechanical Cycling of Sn-Ag-Cu alloys
P Kumar, B Talenbanpour, U Sahaym, CH Wen, I Dutta
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 ... , 2012
4 2012
Fracture of Sn-Ag-Cu solder joints on Cu substrates: I. Effects of loading and processing conditions
Z Huang, P Kumar, I Dutta, JHL Pang, R Sidhu, M Renavikar, R Mahajan
Journal of electronic materials 41 (2), 375-389 , 2012
28 2012
Fracture of Sn-Ag-Cu solder joints on Cu substrates. II: fracture mechanism map
P Kumar, Z Huang, I Dutta, R Sidhu, M Renavikar, R Mahajan
Journal of electronic materials 41 (2), 412-424 , 2012
21 2012
Interfacial effects during thermal cycling of Cu-filled through-silicon vias (TSV)
P Kumar, I Dutta, MS Bakir
Journal of electronic materials 41 (2), 322-335 , 2012
46 2012
Microstructurally adaptive model for primary and secondary creep of Sn-Ag-based solders
P Kumar, Z Huang, SC Chavali, DK Chan, I Dutta, G Subbarayan, V Gupta
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (2 ... , 2012
22 2012
Thermal and Mechanical Characterization of Cu/Cu-In Solder Joints for Thermal Interface and Interconnect Applications: Effects of Interfacial Layers
J Liu, P Kumar, I Dutta, R Sidhu
AIP Conference Proceedings , 2012
  2012
Microstructural Evolution in SnAgCu Solders and Effect on Constitutive Response During Creep
B Talebanpour, P Kumar, Z Huang, CH Wen, I Dutta
AIP Conference Proceedings , 2012
  2012
Influence of Microstructure on Creep and High Strain Rate Fracture of Sn‐Ag‐Based Solder Joints
P Kumar, Z Huang, I Dutta, G Subbarayan, R Mahajan
Lead-Free Solders: Materials Reliability for Electronics, 195-231 , 2012
6 2012
Liquid phase sintered Cu–In composite solders for thermal interface material and interconnect applications
J Liu, P Kumar, I Dutta, R Raj, R Sidhu, M Renavikar, R Mahajan
Journal of materials science 46 (21), 7012-7025 , 2011
14 2011
Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias
I Dutta, P Kumar, MS Bakir
JOM 63 (10), 70 , 2011
21 2011
Aging aware constitutive models for SnAgCu solder alloys
S Chavali, Y Singh, P Kumar, G Subbarayan, I Dutta, DR Edwards
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, 701-705 , 2011
7 2011
Influence of electric current on diffusionally accommodated sliding at hetero-interfaces
P Kumar, I Dutta
Acta Materialia 59 (5), 2096-2108 , 2011
12 2011
Effects of Reflow Parameters and Aging on Fracture Toughness of a Lead-Free Solder Joint under Dynamic Loading Conditions
Z Huang, P Kumar, I Dutta, R Sidhu, M Renavikar, R Mahajan
Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box ... , 2011
  2011
Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials
J Liu, P Kumar, I Dutta, CM Nagaraj, R Raj, M Renavikar, R Mahajan
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and ... , 2011
  2011
High Strain Rate Fracture Behavior of Sn-Ag-Cu Solder Joints on Cu Substrates
Z Huang, P Kumar, I Dutta, JHL Pang, R Sidhu, M Renavikar, R Mahajan
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and ... , 2011
  2011
Fracture mechanism map for the fracture of microelectronic Pb-free solder joints under dynamic loading conditions
Z Huang, P Kumar, I Dutta, JHL Pang, R Sidhu, M Renavikar, R Mahajan
Electronics Packaging Technology Conference (EPTC), 2010 12th, 298-303 , 2010
  2010
Electric current induced liquid metal flow and metallic conformal coating of conductive templates
I Dutta, I Dutta
US Patent 7,811,918 , 2010
  2010
Development of a microstructurally adaptive unified primary-cumsecondary creep model for SAC387 solder joints
Z Huang, P Kumar, I Dutta, G Subbarayan, V Gupta, D Chan, CH Wen
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2010 ... , 2010
1 2010
Correlation between surface whisker growth and interfacial precipitation in aluminum thin films on silicon substrates
I Dutta, M Burkhard, S Kuwano, T Fujita, MW Chen
Journal of materials science 45 (12), 3367-3374 , 2010
4 2010
Interaction between Electromigration and Diffusionally Accommodated Interfacial Sliding at Hetero-Interfaces
P Kumar, I Dutta
Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box ... , 2010
  2010
Liquid Phase Sintered Solders as Thermal Interface Materials for Conventional and High Temperature Electronic Applications
J Liu, P Rottmann, S Dutta, C Nagaraj, P Kumar, M Renavikar, R Raj, ...
Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box ... , 2010
  2010
Influence of Interface Reaction on Out-of-Plane Displacements During Thermal Cycling of Copper-Silicon Bond with an Indium Interlayer
D Gruber, NC Machavallavan, J Liu, I Dutta, R Raj
Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box ... , 2010
  2010
A Quantitative Assessment of Microstructural Coarsening of SnAgCu solders: Effect of Metallization and Thermo-mechanical History
P Kumar, Z Huang, I Dutta, G Subbarayan, V Gupta
Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box ... , 2010
1 2010
Next generation materials for thermal interface and high density energy storage applications via liquid phase sintering
J Liu, P Rottman, S Dutta, P Kumar, R Raj, M Renavikar, I Dutta
Electronics Packaging Technology Conference, 2009. EPTC'09. 11th, 506-511 , 2009
9 2009
Liquid phase sintered solders with indium as minority phase for next generation thermal interface material applications
I Dutta, R Raj, P Kumar, T Chen, CM Nagaraj, J Liu, M Renavikar, ...
Journal of electronic materials 38 (12), 2735-2745 , 2009
24 2009
Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties
I Dutta, P Kumar, G Subbarayan
JOM Journal of the Minerals, Metals and Materials Society 61 (6), 29-38 , 2009
49 2009
Texture development and strain hysteresis in a NiTi shape-memory alloy during thermal cycling under load
B Ye, BS Majumdar, I Dutta
Acta Materialia 57 (8), 2403-2417 , 2009
36 2009
Electric current induced liquid metal flow: Application to coating of micropatterned structures
I Dutta, P Kumar
Applied Physics Letters 94 (18), 184104 , 2009
11 2009
Next Generation Solder-Systems for Thermal Interface and Interconnect Applications via Liquid Phase Sintering
J Liu, P Kumar, I Dutta, R Raj, M Renavikar
ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat ... , 2009
  2009
Observations of Changes in Rate Dependent Flow of SnAgCu Solder Alloys Due to Aging
SC Chavali, K Mysore, G Subbarayan, I Dutta
ASME 2009 International Mechanical Engineering Congress and Exposition, 173-178 , 2009
1 2009
Role of Process and Microstructural Parameters on Mixed Mode Fracture of Sn-Ag-Cu Solder Joints Under Dynamic Loading Conditions
P Kumar, Z Huang, I Dutta, R Mahajan, M Renavikar, R Sidhu
ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat ... , 2009
8 2009
High Strain Rate Behavior of Sn3. 8Ag0. 7Cu Solder Alloys and Its Influence on the Fracture Location Within Solder Joints
D Chan, X Nie, D Bhate, G Subbarayan, I Dutta
ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat ... , 2009
9 2009
Mechanistic model for aging influenced steady state flow behavior of Sn3. 8Ag0. 7Cu solder alloys
K Mysore, S Chavali, D Chan, G Subbarayan, I Dutta, V Gupta, D Edwards
ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat ... , 2009
5 2009
Electric-Current-Induced Liquid Al Deposition, Reaction, and Flow on Cu Rails at Rail–Armature Contacts in Railguns
I Dutta, L Delaney, B Cleveland, C Persad, F Tang
IEEE Transactions on Magnetics 45 (1), 272-277 , 2009
13 2009
Novel liquid phase sintered solders with indium as minority phase for next generation thermal interface material applications
P Kumar, I Dutta, R Raj, M Renavikar, V Wakharkar
Thermal Issues in Emerging Technologies, 2008. ThETA'08. Second ... , 2008
9 2008
Joint scale dependence of aging kinetics in Sn-Ag-Cu solders
P Kumar, O Cornejo, I Dutta, G Subbarayan, V Gupta
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th, 903-909 , 2008
12 2008
Rate-dependent behavior of Sn3. 8Ag0. 7Cu solder over strain rates of 10− 6 to 10 2 s− 1
X Nie, D Bhate, D Chan, W Chen, G Subbarayan, I Dutta
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM ... , 2008
11 2008
Effects of strain rate and aging on deformation and fracture of Sn-Ag-Cu solder joints
P Kumar, I Dutta, V Sarihan, DR Frear, M Renavikar
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM ... , 2008
11 2008
Aging-informed behavior of Sn3. 8Ag0. 7Cu solder alloys
K Mysore, D Chan, D Bhate, G Subbarayan, I Dutta, V Gupta, J Zhao, ...
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM ... , 2008
16 2008
Effect of Ag and Cu concentrations on the creep behavior of Sn-based solders
T Chen, I Dutta
Journal of Electronic Materials 37 (3), 347-354 , 2008
42 2008
Deformation behavior of Sn-3.8 Ag-0.7 Cu solder at intermediate strain rates: Effect of microstructure and test conditions
X Long, I Dutta, V Sarihan, DR Frear
Journal of Electronic Materials 37 (2), 189-200 , 2008
43 2008
Novel liquid phase sintered sn-in solders with tailorable properties for thermal interface material and interconnect applications
I Dutta, R Raj, D Suh, V Wakharkar
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th, 365-369 , 2007
3 2007
Texture memory and strain-texture mapping in a NiTi shape memory alloy
B Ye, BS Majumdar, I Dutta
Applied Physics Letters 91 (6), 061918 , 2007
15 2007
Effect of current crowding on microstructural evolution at rail-armature contacts in railguns
T Chen, X Long, I Dutta, C Persad
IEEE transactions on magnetics 43 (7), 3278-3286 , 2007
21 2007
A comparison of impression and compression creep behavior of polycrystalline Sn
C Park, X Long, S Haberman, S Ma, I Dutta, R Mahajan, SG Jadhav
Journal of materials science 42 (13), 5182-5187 , 2007
35 2007
A highly accelerated thermal cycling (HATC) test for solder joint reliability assessment in BGA packages
X Long, I Dutta, R Guduru, R Prasanna, M Pacheco
Proceedings of IPACK, Vancouver, BC, 1-8 , 2007
4 2007
Smart Lead-Free Solders via Shape-Memory Alloy Reinforcement
I Dutta, BS Majumdar, T Chen, KC Chung, B Ye
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS 968, 57 , 2007
  2007
A highly accelerated thermal cycling (HATC) test for solder reliability assessment in BGA packages
X Long, I Dutta, R Guduru, R Prasanna, M Pacheco
ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal ... , 2007
1 2007
Effect of Ag and Cu concentrations on creep of Sn-based solders
T Chen, I Dutta, S Jadhav
ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal ... , 2007
7 2007
Role of shape-memory alloy reinforcements on strain evolution in lead-free solder joints
I Dutta, D Pan, S Ma, BS Majumdar, S Harris
Journal of electronic materials 35 (10), 1902-1913 , 2006
10 2006
Effect of internal stresses on thermo-mechanical stability of interconnect structures in microelectronic devices
I Dutta, C Park, J Vella
Materials Science and Engineering: A 421 (1), 118-132 , 2006
7 2006
Thermal cycle response of a lead-free solder reinforced with adaptive shape memory alloy
ZX Wang, I Dutta, BS Majumdar
Materials Science and Engineering: A 421 (1), 133-142 , 2006
14 2006
Thermomechanical response of a lead-free solder reinforced with a shape memory alloy
ZX Wang, I Dutta, BS Majumdar
Scripta materialia 54 (4), 627-632 , 2006
23 2006
Internal stress and thermo-mechanical behavior in multi-component materials systems
I DUTTA, B MAJUMDAR
Materials science & engineering. A, Structural materials: properties ... , 2006
  2006
Smart Lead-Free Solders via Shape-Memory Alloy Reinforcement
I Dutta, BS Majumdar, KC Chung, B Ye
MRS Proceedings 968, 0968-V06-04 , 2006
  2006
Effect of thermo-mechanically induced microstructural coarsening on the evolution of creep response of SnAg-based microelectronic solders
I Dutta, D Pan, RA Marks, SG Jadhav
Materials Science and Engineering: A 410, 48-52 , 2005
104 2005
Modeling of interfacial sliding and film crawling in back-end structures of microelectronic devices
I Dutta, KA Peterson, C Park, J Vella
IEEE Transactions on Components and Packaging Technologies 28 (3), 397-407 , 2005
10 2005
Impression creep characterization of 90Pb-10Sn microelectronic solder balls at subsolvus and supersolvus temperatures
D Pan, I Dutta, SG Jadhav, GF Raiser, S Ma
Journal of electronic materials 34 (7), 1040-1046 , 2005
13 2005
Impression creep testing and microstructurally adaptive creep modeling of lead free solder interconnects
I Dutta, D Pan, S Jadhav
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro ... , 2005
31 2005
Redistribution of alloying elements in quasicrystallized Zr 65 Al 7.5 Ni 10 Cu 7.5 Ag 10 bulk metallic glass
MW Chen, A Inoue, T Sakurai, ESK Menon, R Nagarajan, I Dutta
Physical Review B 71 (9), 092202 , 2005
8 2005
Creep Behavior of Lead Free Solder Interconnects in Microelectronic Packages: Impression Creep Testing and Constitutive Modeling
I Dutta, D Pan, S Jadhav, R Mahajan
ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and ... , 2005
  2005
Inhomogeneous, disordered, and partially ordered systems-Redistribution of alloying elements in quasierystallized Zr65Al7. 5Ni10Cu7. 5Ag10 bulk metallic glass
MW Chen, A Inoue, T Sakurai, ESK Menon, R Nagarajan, I Dutta
Physical Review-Section B-Condensed Matter 71 (9), 92202-92202 , 2005
  2005
Miniaturized impression creep testing of ball grid array solder balls attached to microelectronic packaging substrates
D Pan, RA Marks, I Dutta, R Mahajan, SG Jadhav
Review of Scientific Instruments 75 (12), 5244-5252 , 2004
27 2004
Environmentally protected hot-stage atomic force microscope for studying thermo-mechanical deformation in microelectronic devices
C Park, TE Shultz, I Dutta
Review of scientific instruments 75 (11), 4662-4670 , 2004
5 2004
A mechanics-induced complication of impression creep and its solution: application to Sn–3.5 Ag solder
D Pan, I Dutta
Materials Science and Engineering: A 379 (1), 154-163 , 2004
29 2004
Impression creep characterization of rapidly cooled Sn–3.5 Ag solders
I Dutta, C Park, S Choi
Materials Science and Engineering: A 379 (1), 401-410 , 2004
100 2004
Impression creep testing and constitutive modeling of Sn-based solder interconnects
RA Marks, D Pan, I Dutta, SG Jadhav
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM ... , 2004
3 2004
Development of a novel adaptive lead-free solder containing reinforcements displaying the shape-memory effect
I Dutta, BS Majumdar, D Pan, WS Horton, W Wright, ZX Wang
Journal of electronic materials 33 (4), 258-270 , 2004
38 2004

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