Washington State University

Rahul Panat - Associate Professor

The School of Mechanical and Materials Engineering

Rahul Panat - Associate Professor

Interdisciplinary Excellence Built On World-Class Knowledge

portrait
Rahul Panat

Contact Information:

office EE/ME 147
telephone 509 335 9814
e-mail rahul.panat@wsu.edu
Postal mail Rahul Panat
School of Mechanical and Materials Engineering
Washington State University
PO BOX 642920
Pullman, WA 99164-2920

Joined MME in 2014;
Ph.D. in Theoretical and Applied Mechanics from the University of Illinois at Urbana-Champaign, 2004

Research Interests:

  • Manufacturing
  • Microelectronics/Flexible Electronics
  • Li-ion Batteries
  • Thermal Barrier Coatings
  • Thermodynamics

Affiliations and Awards:

  • MRS Gold Medal, 2002
  • Recognition award at Intel Corporation for developing manufacturing processes for first fully ‘green’ IC chip, 2007

Recent Publications:

  • Y. Arafat, I. Dutta, R. Panat, “Super-stretchable Metallic Interconnects on Polymer with a Linear Strain of up to 100%” Applied Physics Letters, 107, 081906, 2015. doi: http://dx.doi.org/10.1063/1.4929605
  • M. T. Rahman, J. McCloy, C. V. Ramana, and R. Panat, “Effect of Microstructure on the High-Temperature Electrical Stability of Additively Manufactured Sintered Silver Nanoparticle Films”, Journal of Applied Physics, Vol. 120, Issue 7, pp. 075305-1 to 11, 2016. doi: http://dx.doi.org/10.1063/1.4960779
  • M. T. Rahman, L. Renaud, M. Renn, D. Heo, R. Panat, “Aerosol Based Direct-Write MicroAdditive Fabrication Method for Sub-mm 3-D Metal-Dielectric Structures”, Journal of Micromechanics and Microengineering, Vol. 25 (10), pp. 107002 (2015). doi: http://dx.doi.org/10.1088/0960-1317/25/10/107002
  • Z. Song, T. Ma, R Tang, Q. Cheng, X. Wang, D. Krishnaraju, R. Panat, C. K. Chan, H. Yu, and H. Jiang, "Origami Lithium Ion Batteries", Nature Communications, doi:10.1038/ncomms4140, 2014.
  • M. T. Rahman, A. Rahimi, S. Gupta, and R. Panat, “Microscale additive manufacturing and simulations of interdigitated capacitive touch sensors“, Sensors and Actuators A: Physical, Vol. 248, 94-103, 2016.

Publications listed at Google Scholar:

43 Titles in date order
List format:
 Title (Link to document)
 Authors
 Source Publication
Cited by Year
Self-Assembled Axisymmetric Microscale Periodic Wrinkles on Elastomer Fibers
J Geng, MT Rahman, R Panat, L Li
Journal of Micro and Nano-Manufacturing 5 (2), 021006 , 2017
  2017
Manufacturing PDMS micro lens array using spin coating under a multiphase system
R Sun, H Yang, DM Rock, R Danaei, R Panat, MR Kessler, L Li
Journal of Micromechanics and Microengineering 27 (5), 055012 , 2017
  2017
Three-dimensional microarchitected materials and devices using nanoparticle assembly by pointwise spatial printing
MS Saleh, C Hu, R Panat
Science Advances 3 (3), e1601986 , 2017
  2017
High Temperature Physical and Chemical Stability and Oxidation Reaction Kinetics of Ni–Cr Nanoparticles
MT Rahman, K Mireles, JJ Gomez Chavez, PC Wo, J Marcial, MR Kessler, ...
The Journal of Physical Chemistry C 121 (7), 4018-4028 , 2017
  2017
A hybrid three-dimensionally structured electrode for lithium-ion batteries via 3D printing
J Li, MC Leu, R Panat, J Park
Materials & Design 119, 417-424 , 2017
8 2017
Manufacturing of Smart Goods: Current State, Future Potential, and Research Recommendations
BK Paul, R Panat, C Mastrangelo, D Kim, D Johnson
Journal of Micro and Nano-Manufacturing 4 (4), 044001 , 2016
2 2016
On the deformation mechanisms and electrical behavior of highly stretchable metallic interconnects on elastomer substrates
Y Arafat, I Dutta, R Panat
Journal of Applied Physics 120 (11), 115103 , 2016
  2016
Structure, electrical characteristics, and high-temperature stability of aerosol jet printed silver nanoparticle films
MT Rahman, J McCloy, CV Ramana, R Panat
Journal of Applied Physics 120 (7), 075305 , 2016
2 2016
3-D printed adjustable microelectrode arrays for electrochemical sensing and biosensing
H Yang, MT Rahman, D Du, R Panat, Y Lin
Sensors and Actuators B: Chemical 230, 600-606 , 2016
8 2016
Microscale Additive Manufacturing and Modeling of Interdigitated Capacitive Touch Sensors
MT Rahman, A Rahimi, S Gupta, R Panat
Sensors and Actuators A: Physical 248, 93-104 , 2016
4 2016
Low-cost fiber optic sensor for large strains
R Panat, L Li, , L Li
US Patent App. 15/098,891 , 2016
1 2016
Three dimensional sub-mm wavelength sub-thz frequency antennas on flexible and uv-curable dielectric using printed electronic metal traces
R Panat, DH Heo, , DH Heo
US Patent App. 14/964,635 , 2015
  2015
Three-dimensional passive components
RP Panat, DH Heo, , DH Heo
US Patent App. 14/964,451 , 2015
1 2015
Additive manufacturing of porous scaffold structures
R Panat, R Panat
US Patent App. 14/957,849 , 2015
  2015
A model for crack initiation in the Li-ion battery electrodes
R Panat
Thin Solid Films 596, 174-178 , 2015
1 2015
Highly stretchable interconnect devices and systems
R Panat, R Panat
US Patent App. 14/839,933 , 2015
  2015
Super-stretchable metallic interconnects on polymer with a linear strain of up to 100%
Y Arafat, I Dutta, R Panat
Applied Physics Letters 107 (8), 081906 , 2015
5 2015
Highly Stretchable Interconnects for Flexible Electronics Applications
Y Arafat, R Panat, I Dutta
ASME 2015 International Technical Conference and Exhibition on Packaging and ... , 2015
  2015
3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method
MT Rahman, R Panat, D Heo
ASME 2015 International Technical Conference and Exhibition on Packaging and ... , 2015
  2015
Advanced Manufacturing for Smart Goods
BK Paul, R Panat, C Mastrangelo, D Kim
  2015
Aerosol Based Direct-Write Micro-Additive Fabrication Method for Sub-mm 3-D Metal-Dielectric Structures
MT Rahman, L Renaud, M Renn, D Heo, R Panat
Journal of Micromechanics and Microengineering 25 (10), 107002 , 2015
11 2015
The application of Lean Six Sigma to the configuration control in Intel’s manufacturing R&D environment
R Panat*, V Dimitrova, T Selvy Selvamuniandy, K Ishiko, D Sun
International Journal of Lean Six Sigma 5 (4), 444-459 , 2014
6 2014
Mechanical reliability of embedded array capacitors in ultrahigh-performance microprocessors
R Panat, S Dattaguru, H Balkan, Y Min, H Seh, X Zhao
IEEE Transactions on Device and Materials Reliability 14 (3), 857-863 , 2014
1 2014
On the data and analysis of the research output of India and China: India has significantly fallen behind China
R Panat
Scientometrics 100 (2), 471-481 , 2014
5 2014
Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing same
NR Raravikar, R Panat, , R Panat
US Patent 8,724,290 , 2014
  2014
Origami lithium-ion batteries
Z Song, T Ma, R Tang, Q Cheng, X Wang, D Krishnaraju, R Panat, ...
Nature communications 5 , 2014
107 2014
Effects of Triboelectrostatic Charging Between Polymer Surfaces in Manufacturing and Test of Integrated Circuit Packages
R Panat, J Wang, E Parks
Components, Packaging and Manufacturing Technology, IEEE Transactions on, 1-1 , 2014
3 2014
Nanowires coated on traces in electronic devices
R Panat, B Jaiswal
WO Patent WO2013095663 A1 , 2013
  2013
Embedded capacitors in the next generation processor
Y Min, R Olmedo, M Hill, K Radhakrishnan, K Aygun, M Kabiri-Badr, ...
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, 1225 ... , 2013
6 2013
Tombstone Initiation Model for Small Form-Factor Surface Mount Passives
N Raravikar, R Panat, S Jadhav
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (9 ... , 2012
1 2012
Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing same
NR Raravikar, R Panat, , R Panat
US Patent 8,068,328 , 2011
2 2011
The Application of Two-Dimensional X-ray Hot Stage in Flip Chip Package Failure Analysis
Y Li, R Panat, B Li, R Mulligan, PKM Srinath, A Raman
IEEE Transactions on Device and Materials Reliability 11 (1), 141-147 , 2011
2 2011
In-Situ 2 D X-Ray Study of Pb-Free Solder Joints and Next Generation Thermal Interface Material in Flip Chip Packages
Y Li, R Panat, B Li, R Mulligan, PKM Srinatha, A Raman
Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box ... , 2011
  2011
The application of 2D X-ray hot stage in flip chip package failure analysis
Y Li, R Panat, B Li, R Mulligan, PKM Srinath, A Raman
  2010
Rumpling instability in thermal barrier systems under isothermal conditions in vacuum
R Panat, KJ Hsia, J Oldham
Philosophical Magazine 85 (1), 45-64 , 2005
20 2005
Evolution of surface waviness in thin films via volume and surface diffusion
R Panat, KJ Hsia, DG Cahill
Journal of applied physics 97 (1), 013521 , 2005
53 2005
Experimental investigation of the bond-coat rumpling instability under isothermal and cyclic thermal histories in thermal barrier systems
R Panat, KJ Hsia
Proceedings of the Royal Society of London A: Mathematical, Physical and ... , 2004
23 2004
On the rumpling instability in thermal barrier systems
RP Panat
University of Illinois at Urbana-Champaign , 2004
3 2004
Bond coat surface rumpling in thermal barrier coatings
R Panat, S Zhang, KJ Hsia
Acta Materialia 51 (1), 239-249 , 2003
71 2003
Influence of surface morphology on the adhesion strength of epoxy–aluminum interfaces
S Zhang, R Panat, KJ Hsia
Journal of Adhesion Science and Technology 17 (12), 1685-1711 , 2003
29 2003
24th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A-CERAMIC MATRIX COMPOSITES-Particulate Reinforced Composites: Oxides-Erosion and Strength Degradation of an
RP Panat, K Jakus, JE Ritter, P Shah
Ceramic Engineering and Science Proceedings 21 (3), 635-642 , 2000
  2000
Erosion and Strength Degradation of an Elastic Modulus Graded Alumina‐Glass Composite
RP Panat, K Jakus, JE Ritter
24th Annual Conference on Composites, Advanced Ceramics, Materials, and ... , 2000
2 2000
Impact Damage and Strength Degradation of Fused Silica
JE Ritter, K Jakus, RP Panat
MRS Proceedings 531, 53 , 1998
1 1998

Use scroll bar in box above to view more titles.

Intellectual Property:

  • Panat R. and Jaiswal B., "Nanowires coated on traces in electronic devices" International Patent, Publication #WO2013095663, 2013
  • Raravikar N. and Panat R., "Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing the same", US Patent 8068328, 2011

Links:

School of Mechanical and Materials Engineering, PO Box 642920, Washington State University, Pullman WA 99164-2920, 509-335-8654, Contact Us