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Contact Information:
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Joined MME in Sept 2008
PhD, University of Southern California, Los Angles, in 2007
Research Interests:
- Electromigration: Effect of electromigration on interfacial sliding, electromigration in pure liquid metals, application of liquid metal electromigration
- Microelectronic Packaging: Microstructural coarsening in lead free solders, interfacial fracture under high strain rates, tin whiskering, thermal interface management materials
- Mechanical Properties of Materials: Creep, Fracture, Fatigue, Severe Plastic Deformation, Superplasticity
Recent Publications:
- Kumar P. and Dutta I., “Manipulating Diffusionally Accommodated Interfacial Sliding at Hetero-Interfaces via Electromigration: A Design Tool for Smarter Microelectronic Devices”, Acta Mater (in preparation).
- Dutta I. and Kumar P., “Electric current induced liquid metal flow: Application to coating of micro-patterned structures”, App. Phys. Lett. 94 (2009) 184104.
- Dutta I., Raj R., Kumar P., Chen T., Nagaraj C. M., Liu J., Renavikar M. and Wakharkar V., “Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications”, J. Elec. Mater. (in press).
- Dutta I., Kumar P. and Subbarayan G., “Microstructural ooarsening in Sn-Ag-based solders and its effects on mechanical properties” J. Metals 61 (06) (2009) 29.
- Kumar P., Xu C. and Langdon T. G., “Influence of strain rate on strength and ductility in an aluminum alloy processed by ECAP”, J. Mater. Sci. 44 (2009) 3913.
- Kumar P., Dutta I., Sarihan V., Frear D. R., Jadhav S. and Renavikar M., “Effects of strain rate and aging on deformation and fracture of Sn-Ag-Cu solder joints”, Proc.11th Intersociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE/ASME, Orlando, FL, 28 – 31 May (2008) 660.
Links:
Formula SAE car in testing for 2008 competition